Job Description

Signal Integrity Engineer

Location : San Jose, CA

Join a cutting-edge technology company specializing in the advancements in high-performance computing, data centers, and next-generation networking. You will play a pivotal role in designing and optimizing advanced interconnect technologies, focusing on high-speed parallel interfaces, including 2.5D and 3D architectures. This dynamic position combines R&D responsibilities with customer-facing engagements to deliver industry-leading solutions.

Key Responsibilities:

Development & Analysis

• Perform timing signoff for advanced parallel interfaces, leveraging time-domain simulations (e.g., SPICE).
• Conduct electromagnetic extraction and modeling for signal and power delivery networks, including PCBs, packages, and interposers.
• Analyze AC and transient behavior of power distribution networks (PDN).
• Develop pre-layout models for transceivers, signal paths, and PDN networks.
• Execute IO channel analysis to ensure optimal performance of high-speed designs.

Process Optimization & Automation

• Automate critical signoff processes using scripting languages such as TCL and Python.
• Collaborate with EDA tool providers to enhance accuracy and streamline workflows.

Documentation & Support

• Prepare detailed analysis reports, signoff documentation, and technical presentations for internal and customer stakeholders.
• Engage in pre-sales technical discussions to support customer design requirements and solutions.

Collaborative Development

• Partner with cross-functional teams, including R&D, IP development, and manufacturing, to innovate and deploy next-generation interconnect technologies.
• Contribute to the development of MCM, 2.5D, and 3D interconnect IP and solutions.

Required Qualifications:

Education & Experience

• BS/MS in Electrical Engineering, Computer Engineering, or a related field.
• 8+ years of experience in signal integrity (SI) engineering, focusing on IC, package, and PCB design.

Technical Expertise

• Proficient in analyzing IC, package, and PCB databases.
• Strong scripting skills in TCL and Python for process automation.
• Familiarity with at least one DDR timing signoff flow tool suite.
• Expertise in electromagnetic modeling and extraction tools for SI and PDN analysis.

Soft Skills

• Self-driven and able to work independently across global teams and customer bases.
• Strong multitasking abilities to manage multiple projects under tight deadlines.
• Excellent communication skills to effectively present technical concepts to diverse audiences.
• Adaptability to integrate innovative tools and methodologies into existing workflows.

Preferred Qualifications

• Experience in 2.5D and 3D interconnect technologies.
• Knowledge of developing interconnect IP for multi-chip modules (MCM), package, and interposer designs.
• Proven ability to address customer-specific challenges with tailored solutions.

This role offers a unique opportunity to drive innovation in high-speed interconnect technologies and collaborate with industry-leading experts. If you thrive in a fast-paced, technology-driven environment, apply today to become part of a forward-thinking team.

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